Oxygen relocation during HfO2 ALD on InAs
Atomic layer deposition (ALD) is one of the backbones for today’s electronic device fabrication. A critical property of ALD is the layer-by-layer growth, which gives rise to the atomic-scale accuracy. However, the growth rate - or growth per cycle - can differ significantly depending on the type of system, molecules used, and several other experimental parameters. Typically, ALD growth rates are c
