Optimization of through-silicon via structures in a fingerprint sensor package
The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. However, since TSV structures are both more complex as structures and have a more complex manufact